Invention Grant
- Patent Title: Method of preparing and using photosensitive material
- Patent Title (中): 制备和使用感光材料的方法
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Application No.: US14310656Application Date: 2014-06-20
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Publication No.: US09529265B2Publication Date: 2016-12-27
- Inventor: An-Ren Zi , Chen-Hau Wu , Ching-Yu Chang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G03F7/26
- IPC: G03F7/26 ; G03F7/32 ; G03F7/039 ; G03F7/30 ; G03F7/004 ; G03F7/038 ; G03F7/11 ; G03F7/20
Abstract:
Provided in one embodiment is a method that includes selecting a photoresist that is one of a positive-tone photoresist and a negative-tone photoresist. A first additive or a second additive is selected based on the photoresist. The first additive has a fluorine component and a base component attached to a polymer and is selected if the a positive-tone resist is provided. The second additive has the fluorine component and an acid component attached to the polymer and is selected with a negative-tone resist is provided. The selected photoresist and the selected additive material are applied to a target substrate.
Public/Granted literature
- US20150316846A1 Method of Preparing and Using Photosensitive Material Public/Granted day:2015-11-05
Information query
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