Invention Grant
- Patent Title: Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device
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Application No.: US14986130Application Date: 2015-12-31
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Publication No.: US09530681B2Publication Date: 2016-12-27
- Inventor: Calvin Leung , Olivier Le Neel
- Applicant: STMicroelectronics Pte Ltd
- Applicant Address: SG Singapore
- Assignee: STMICROELECTRONICS PTE. LTD.
- Current Assignee: STMICROELECTRONICS PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/768 ; H01L27/06 ; H01L23/498 ; H01L23/538 ; H01L23/31 ; H01L21/56 ; H01L21/48 ; H01L23/00 ; H01L27/105 ; H01L49/02 ; H01L29/66
Abstract:
An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.
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Information query
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