Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14862102Application Date: 2015-09-22
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Publication No.: US09530723B2Publication Date: 2016-12-27
- Inventor: Akira Muto , Koji Bando , Yukihiro Sato , Kazuhiro Mitamura
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2014-194648 20140925
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; B60L3/00 ; B60L11/18 ; B60L15/00 ; H01L23/31 ; H01L21/56 ; H01L23/544
Abstract:
On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the extension parts is mounted and supported on the pair of the hanging parts. Accordingly, the clip is mounted on a lead (one point) and the pair of the hanging parts (two points), and the clip is supported by the three points.
Public/Granted literature
- US20160148859A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-05-26
Information query
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