Invention Grant
- Patent Title: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
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Application No.: US14604545Application Date: 2015-01-23
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Publication No.: US09530748B2Publication Date: 2016-12-27
- Inventor: Choon Kuan Lee , Chin Hui Chong , David J. Corisis
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/00 ; H01L21/768 ; H01L23/31 ; H01L23/48 ; H01L25/065 ; H01L25/00

Abstract:
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member, a first die attached to the support member, and a second die attached to the first die in a stacked configuration. The device can also include an attachment feature between the first and second dies. The attachment feature can be composed of a dielectric adhesive material. The attachment feature includes (a) a single, unitary structure covering at least approximately all of the back side of the second die, and (b) a plurality of interconnect structures electrically coupled to internal active features of both the first die and the second die.
Public/Granted literature
- US20150130081A1 PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES Public/Granted day:2015-05-14
Information query
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