A multilayer substrate includes a first substrate a second substrate that is stacked on and electrically connected to the first substrate, the second substrate having a different characteristic from a characteristic of the first substrate, a third substrate that is provided on a side of the first substrate, the second substrate being provided on the side of the first substrate, and the third substrate is electrically connected to the second substrate, and a connection member that electrically connects the first substrate and the third substrate to each other while the second substrate is bypassed.