公开(公告)号：US20190306973A1

公开(公告)日：2019-10-03

申请号：US16285719

申请日：2019-02-26

申请人： FUJITSU LIMITED

发明人： Shunji Baba

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/09

摘要： An electronic device includes a first substrate having bendability, a second substrate configured to include a first electrode and provided over the first substrate, a third substrate configured to include a second electrode and provided over the first substrate with a space from the second substrate, a first electronic component configured to be electrically coupled to the first electrode and provided over the second substrate, a second electronic component configured to be electrically coupled to the second electrode and provided over the third substrate, and a wiring configured to include a plurality of conductive thread-shaped members sewn into the first substrate in an extensible and contractible state so as to be electrically coupled the first electrode to the second electrode.

公开(公告)号：US09740976B2

公开(公告)日：2017-08-22

申请号：US15012967

申请日：2016-02-02

申请人： FUJITSU LIMITED

发明人： Noritsugu Ozaki ,  Shunji Baba ,  Takayoshi Matsumura

IPC分类号： G06K19/07 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q9/06 ,  H01Q9/28 ,  G06K19/02 ,  G06K19/077

CPC分类号： G06K19/0723 ,  G06K19/022 ,  G06K19/07786 ,  H01Q1/2208 ,  H01Q7/00 ,  H01Q9/065 ,  H01Q9/285

摘要： An RFID tag includes a core formed by a first elastic material and having a first surface, a second surface on an opposite side of the first surface, and a pair of end parts provided on mutually opposite sides and connecting to the first surface and the second surface. The RFID tag further includes a metal layer provided on the first surface, a semiconductor chip provided on the second surface, and a dipole antenna provided on the second surface and electrically connected to the semiconductor chip. One of the metal layer and the dipole antenna is folded at folded parts at the pair of end parts, and the metal layer and the dipole antenna overlap at the folded parts.

公开(公告)号：US20170017873A1

公开(公告)日：2017-01-19

申请号：US15171281

申请日：2016-06-02

申请人： FUJITSU LIMITED

发明人： Shunji Baba ,  Hiroyuki Nakamoto

IPC分类号： G06K19/077 ,  H05K1/02 ,  H05K1/18

CPC分类号： H05K1/028 ,  G06K19/0704 ,  G06K19/0716 ,  G06K19/072 ,  G06K19/07722 ,  G06K19/07728 ,  G06K19/07773 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0314 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10068 ,  H05K2201/10098 ,  H05K2201/10143

摘要： A substrate includes: a base member that has flexibility and insulation properties; an electrically conductive member disposed on the base member and has flexibility and electrical conductivity; an electronic component disposed over the base member and coupled to the electrically conductive member; and a covering member that has flexibility and insulation properties and that covers a portion of the base member and a portion of the electronic component, wherein the covering member has a hardness higher than a hardness of the base member, and wherein the base member is bent so as to hold the covering member inside.

摘要翻译： 基板包括：具有柔性和绝缘性能的基体; 导电构件，其设置在所述基底构件上并具有柔性和导电性; 电子部件，设置在所述基座部件上并且耦合到所述导电部件; 以及覆盖部件，其具有柔性和绝缘性能，并且覆盖所述基部部件的一部分和所述电子部件的一部分，其中所述覆盖部件具有高于所述基部部件的硬度的硬度，并且其中所述基部部件弯曲 以便将盖部件保持在内部。

公开(公告)号：US09532469B2

公开(公告)日：2016-12-27

申请号：US14317498

申请日：2014-06-27

申请人： FUJITSU LIMITED

发明人： Shunji Baba ,  Takashi Kanda

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K1/14

CPC分类号： H05K3/4694 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/14 ,  H05K2201/0352 ,  H05K2203/061

摘要： A multilayer substrate includes a first substrate a second substrate that is stacked on and electrically connected to the first substrate, the second substrate having a different characteristic from a characteristic of the first substrate, a third substrate that is provided on a side of the first substrate, the second substrate being provided on the side of the first substrate, and the third substrate is electrically connected to the second substrate, and a connection member that electrically connects the first substrate and the third substrate to each other while the second substrate is bypassed.

摘要翻译： 多层基板包括第一基板和第二基板，第二基板层叠并电连接到第一基板，第二基板具有与第一基板的特性不同的特性，第三基板设置在第一基板的一侧 所述第二基板设置在所述第一基板的一侧，并且所述第三基板电连接到所述第二基板，以及连接构件，其在所述第二基板旁路的同时使所述第一基板和所述第三基板彼此电连接。

公开(公告)号：US09208425B2

公开(公告)日：2015-12-08

申请号：US14460414

申请日：2014-08-15

申请人： FUJITSU LIMITED

发明人： Takayoshi Matsumura ,  Kenzo Nishide ,  Shigeru Gotou ,  Noritsugu Ozaki ,  Shunji Baba

IPC分类号： G06K19/06 ,  G06K19/077

CPC分类号： G06K19/07728 ,  G06K19/07722 ,  G06K19/07749 ,  G06K19/0776

摘要： An RFID tag including an inlay having a sheet-like shape and including an antenna and an IC chip electrically connected to the antenna, an outer covering member that covers the inlay, the outer covering member having a planar shape and including a main surface and a rear surface, and a frame part arranged on at least one of the main surface and the rear surface. The frame part is erected in a thickness direction of the outer covering member. The frame part surrounds the IC chip in a plan view.

摘要翻译： 一种RFID标签，其包括具有片状形状的嵌体，并且包括天线和与所述天线电连接的IC芯片，覆盖所述嵌体的外覆盖部件，所述外覆盖部件具有平面形状并且包括主表面和 后表面和布置在主表面和后表面中的至少一个上的框架部分。 框架部分在外覆盖件的厚度方向上竖起。 框架部分在平面图中围绕IC芯片。

公开(公告)号：US20130277433A1

公开(公告)日：2013-10-24

申请号：US13827088

申请日：2013-03-14

申请人： FUJITSU LIMITED ,  FUJITSU FRONTECH LIMITED

发明人： Shunji Baba ,  Shigeru Hashimoto ,  Yoshiyasu Sugimura ,  Tsuyoshi Niwata ,  Mimpei Miura

IPC分类号： G06K19/077

CPC分类号： G06K19/07728 ,  G06K19/07749

摘要： An RFID tag includes a first flexible sheet covering a surface of a base part, an antenna and an IC chip; a second flexible sheet covering an another surface of the base part; a first reinforcing member including third and fourth sheets and covering the chip and a connecting portion of the chip and the antenna, the third sheet having flexibility and elasticity and being disposed on the first sheet, the fourth sheet having flexibility and being disposed on the third sheet; a second reinforcing member including fifth and sixth sheets and covering the chip and the connecting portion, the fifth sheet having flexibility and elasticity and being disposed on the second sheet, the sixth sheet having flexibility and being disposed on the fifth sheet; and an outer member having flexibility and elasticity and covering the first and the second sheets and the first and the second reinforcing members.

摘要翻译： RFID标签包括覆盖基部表面的第一柔性片，天线和IC芯片; 覆盖所述基部的另一个表面的第二柔性片; 第一加强构件，包括第三和第四片，并且覆盖所述芯片和所述芯片和所述天线的连接部分，所述第三片材具有柔性和弹性并且布置在所述第一片材上，所述第四片材具有柔性并且被布置在所述第三片材上 片; 第二加强构件，包括第五和第六片并且覆盖所述芯片和所述连接部分，所述第五片材具有柔性和弹性，并且布置在所述第二片材上，所述第六片材具有柔性并设置在所述第五片材上; 以及具有柔性和弹性并覆盖第一和第二片以及第一和第二加强件的外部构件。

公开(公告)号：US10210720B2

公开(公告)日：2019-02-19

申请号：US15584229

申请日：2017-05-02

申请人： FUJITSU LIMITED

发明人： Takayoshi Matsumura ,  Shunji Baba ,  Takashi Kanda ,  Noritsugu Ozaki ,  Hidehiko Kira

IPC分类号： F21S9/03 ,  G08B5/22 ,  H04W4/029 ,  H04W4/80 ,  H01L31/048 ,  G06K19/073 ,  G06K19/077 ,  G12B9/04 ,  H04W12/12

摘要： Electronic equipment includes: a substrate configured to include a first component, a second component, and an interconnection part that couples the first component with the second component by electric interconnections; and an exterior part configured to cover the first component, the second component, and the interconnection parts, and include a first exterior section that covers at least a portion of the first component, and a second exterior section that covers at least a portion of the interconnection parts, a thickness of the first exterior section being different from a thickness of the second exterior section to form a level difference in a boundary part between the first exterior section and the second exterior section.

公开(公告)号：US20170012150A1

公开(公告)日：2017-01-12

申请号：US15168302

申请日：2016-05-31

申请人： FUJITSU LIMITED

发明人： Shunji Baba

IPC分类号： H01L31/048 ,  H01L31/0475 ,  H01L31/02

摘要： A substrate includes: a base member that has flexibility and insulation properties; an electrically conductive member that is disposed on a top surface of the base member and that has flexibility and electrical conductivity; an electronic component that is disposed over the base member and that includes a terminal joined to the electrically conductive member; and a reinforcing member that is disposed on a bottom surface of the base member at a portion corresponding to a portion of the top surface of the base member at which the electrically conductive member is disposed, wherein the reinforcing member is larger in size than an area over which the terminal and the electrically conductive member are joined together.

摘要翻译： 基板包括：具有柔性和绝缘性能的基体; 导电构件，其设置在所述基底构件的顶表面上并且具有柔性和导电性; 电子部件，其设置在所述基部部件上方，并且包括与所述导电部件接合的端子; 以及加强部件，其设置在与形成有所述导电部件的所述基部部件的上表面的一部分对应的部分的所述基部部件的底面上，其特征在于，所述加强部件的尺寸大于面积 端子和导电构件连接在一起。

公开(公告)号：US20160211243A1

公开(公告)日：2016-07-21

申请号：US14969015

申请日：2015-12-15

申请人： FUJITSU LIMITED

发明人： MAKOTO SUWADA ,  Shunji Baba ,  TAKASHI KANDA ,  NORIO KAINUMA

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/1431

摘要： A laminated chip includes: a first chip; a first wiring layer formed on the first chip; a second chip; a second wiring layer formed on the second chip; and a layer disposed between the first wiring layer and the second wiring layer, the layer includes an adhesive agent configured to bond the first wiring layer and the second wiring layer; a plurality of first bumps connected to the first wiring layer; a plurality of second bumps connected to the second wiring layer; and solder connected to the plurality of first bumps and the plurality of second bumps.

摘要翻译： 层叠芯片包括：第一芯片; 形成在第一芯片上的第一布线层; 第二芯片 形成在第二芯片上的第二布线层; 以及设置在所述第一布线层和所述第二布线层之间的层，所述层包括被配置为接合所述第一布线层和所述第二布线层的粘合剂; 连接到第一布线层的多个第一凸块; 连接到第二布线层的多个第二凸块; 并且焊料连接到多个第一凸块和多个第二凸块。

公开(公告)号：US09362202B2

公开(公告)日：2016-06-07

申请号：US14279979

申请日：2014-05-16

申请人： FUJITSU LIMITED

发明人： Shunji Baba ,  Kenji Fukuzono ,  Yuki Hoshino

IPC分类号： G06F1/16 ,  G06F1/20 ,  H05K5/00 ,  H05K7/00 ,  H01L23/473 ,  H01L21/48 ,  H05K1/02

CPC分类号： H01L23/473 ,  H01L21/4882 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0272 ,  Y10T29/49117 ,  H01L2924/00

摘要： An electronic device includes: a support member; an electronic component stacked over the support member with a plurality of connections therebetween; and a refrigerant pipe through which a refrigerant passes, the refrigerant pipe being provided between at least some connections among the plurality of connections. A method for manufacturing an electric device includes: stacking an electronic component over a support member with a plurality of connections therebetween; and providing a refrigerant pipe, through which a refrigerant passes, between at least some connections among the plurality of connections.

摘要翻译： 电子设备包括：支撑构件; 电子部件，堆叠在所述支撑部件上，其间具有多个连接; 以及制冷剂通过的制冷剂管，所述制冷剂管设置在所述多个连接中的至少一些连接部之间。 一种电气设备的制造方法，其特征在于，包括：将电子部件堆叠在支撑部件上，并具有多个连接部; 并且在多个连接中的至少一些连接之间提供制冷剂通过的制冷剂管。