Invention Grant
- Patent Title: Semiconductor package and method of forming the same
- Patent Title (中): 半导体封装及其形成方法
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Application No.: US13272434Application Date: 2011-10-13
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Publication No.: US09536818B2Publication Date: 2017-01-03
- Inventor: Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
- Applicant: Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; B23K1/20 ; H01L21/48 ; H01L23/00
Abstract:
A method of a semiconductor package includes providing a substrate having a conductive trace coated with an organic solderability preservative (OSP) layer, removing the OSP layer from the conductive trace, and then coupling a chip to the substrate to form a semiconductor package.
Public/Granted literature
- US20130093076A1 SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME Public/Granted day:2013-04-18
Information query
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