发明授权
- 专利标题： Drawn dummy FeCAP, via and metal structures
- 专利标题（中）： 绘制虚拟FeCAP，通孔和金属结构
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申请号： US12576340申请日： 2009-10-09
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公开(公告)号： US09536822B2公开(公告)日： 2017-01-03
- 发明人: Scott R. Summerfelt , Rajni J. Aggarwal
- 申请人： Scott R. Summerfelt , Rajni J. Aggarwal
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 代理商 Rose Alyssa Keagy; Charles A. Brill; Frank D. Cimino
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L21/00 ; H01L23/522 ; H01L23/58 ; H01L27/02 ; H01L49/02 ; H01L27/115
摘要：
An integrated circuit containing hydrogen permeable dummy vias configured in a linear or rectangular array and symmetrically positioned over a component in the integrated circuit. An integrated circuit containing matching components with identical layouts and hydrogen permeable dummy vias in identical configurations over the matching components. A process of forming an integrated circuit containing matching components with identical layouts and hydrogen permeable dummy vias in identical configurations over the matching components.
公开/授权文献
- US20100090340A1 Drawn Dummy FeCAP, Via and Metal Structures 公开/授权日：2010-04-15
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