Invention Grant
- Patent Title: Semiconductor device structure and method for forming the same
- Patent Title (中): 半导体器件结构及其形成方法
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Application No.: US14613663Application Date: 2015-02-04
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Publication No.: US09537010B2Publication Date: 2017-01-03
- Inventor: Tsan-Chun Wang , Ziwei Fang , Chien-Tai Chan , Da-Wen Lin , Huicheng Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234 ; H01L29/78 ; H01L29/66 ; H01L21/266 ; H01L21/324

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a doped region in an upper portion of the substrate. The doped region is doped with first dopants of a first conduction type. The semiconductor device structure includes one fin structure over the substrate. A first dopant concentration of the doped region exposed by the fin structure is greater than a second dopant concentration of the doped region covered by the fin structure. The semiconductor device structure includes an isolation layer over the substrate and at two opposite sides of the fin structure. The semiconductor device structure includes a gate over the isolation layer and the fin structure.
Public/Granted literature
- US20160225906A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2016-08-04
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