Invention Grant
- Patent Title: Earphone socket, earphone plug, earphone and electronic device
- Patent Title (中): 耳机插座,耳机插头,耳机和电子设备
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Application No.: US14799286Application Date: 2015-07-14
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Publication No.: US09537271B2Publication Date: 2017-01-03
- Inventor: Hui Li , Wei Sun , Jie Fan
- Applicant: Xiaomi Inc.
- Applicant Address: CN Beijing
- Assignee: Xiaomi Inc.
- Current Assignee: Xiaomi Inc.
- Current Assignee Address: CN Beijing
- Agency: Quarles & Brady LLP
- Priority: CN201410746572 20141208
- Main IPC: H01R24/58
- IPC: H01R24/58 ; H01R105/00 ; H01R13/11 ; H01R13/24 ; H01R13/6471 ; H01R24/22

Abstract:
The present disclosure relates to an earphone socket, an earphone plug, an earphone and an electronic device. For example, the earphone socket may include a socket body in which an earphone jack is formed. The earphone socket may include multiple ground terminals, which may be arranged in the earphone jack. The ground terminals may contact a ground section disposed on an earphone plug when the earphone plug is inserted into the earphone jack. The technical solutions of the present disclosure reduce earphone crosstalk and improve tone quality.
Public/Granted literature
- US20160164234A1 EARPHONE SOCKET, EARPHONE PLUG, EARPHONE AND ELECTRONIC DEVICE Public/Granted day:2016-06-09
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