Invention Grant
- Patent Title: Self-illuminating CMOS imaging package
- Patent Title (中): 自拍CMOS成像包
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Application No.: US13936844Application Date: 2013-07-08
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Publication No.: US09538909B2Publication Date: 2017-01-10
- Inventor: Junzhao Lei , Guannho G. Tsau
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop & Gage LLP
- Main IPC: H01L27/15
- IPC: H01L27/15 ; A61B1/06 ; A61B1/05 ; H01L31/173 ; H01L25/16
Abstract:
A microelectronics chip contains an integrated CMOS imaging sensor integrated with a LED die. Circuitry is established on the chip for a shared power arrangement.
Public/Granted literature
- US20150018611A1 Self-Illuminating CMOS Imaging Package Public/Granted day:2015-01-15
Information query
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