Invention Grant
- Patent Title: Film forming method, film forming apparatus and recording medium
- Patent Title (中): 成膜方法,成膜装置和记录介质
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Application No.: US14697824Application Date: 2015-04-28
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Publication No.: US09540733B2Publication Date: 2017-01-10
- Inventor: Tadahiro Ishizaka
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2014-095887 20140507
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/285 ; H01L21/02 ; C23C16/06 ; C23C16/46 ; C23C16/455 ; C23C16/52 ; C23C16/44 ; H01L23/532 ; C23C16/16

Abstract:
A film forming method in which in a state in which a target substrate is loaded on a loading table body of a loading table installed in a processing container and an interior of the processing container is evacuated, a film forming material gas is supplied into the processing container while heating the target substrate with a heater installed in the loading table body, to be thermally decomposed or reacted on a surface of the target substrate to form a predetermined film on the target substrate, includes introducing a heat transfer gas containing an H2 gas or an He gas into the processing container to transfer heat of the loading table body to a radially outer side of the loading table body, before the film forming material gas is supplied.
Public/Granted literature
- US20150325432A1 FILM FORMING METHOD, FILM FORMING APPARATUS AND RECORDING MEDIUM Public/Granted day:2015-11-12
Information query
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