A method for forming a thin film pattern includes: forming a first resist pattern on a substrate; forming a second resist pattern on the substrate and the first resist pattern, forming a first metal layer overlapping an exposed portion of the substrate and exposed portions of the first and second resist patterns; removing the second resist pattern and a portion of the first metal layer, through a first lift-off process to expose portions of the substrate and the first resist pattern; forming a second metal layer overlapping portions of each of the substrate, the first resist pattern and the first metal layer; and removing the first resist pattern and the first and second metal layers, through a second lift-off process, to form first and second metal patterns from remaining portions of the first and second metal layers. The first and second resist patterns have different dissolution characteristics.