A semiconductor package includes: a plurality of memory packages which are arranged on a substrate; and a logic chip, which has a rhombus shape including first through fourth corners and first through fourth sides connecting the first through fourth corners, is arranged adjacent to the plurality of memory packages, and includes a plurality of terminals that are electrically connected to the plurality of memory packages, as seen on a plan view of the semiconductor package, wherein the plurality of terminals include system address terminals which are adjacent to the first corner of the logic chip and first and second system data terminals which are respectively arranged on the first and second sides contacting the first corner. Another semiconductor package and a method of fabrication are disclosed.