Invention Grant
US09543171B2 Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control element 有权
对半导体衬底支撑组件的温度控制板中的故障热控制元件进行自动校正,包括使故障的热控制元件失效并修改至少一个功能性热控元件的功率水平

  • Patent Title: Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control element
  • Patent Title (中): 对半导体衬底支撑组件的温度控制板中的故障热控制元件进行自动校正,包括使故障的热控制元件失效并修改至少一个功能性热控元件的功率水平
  • Application No.: US14307062
    Application Date: 2014-06-17
  • Publication No.: US09543171B2
    Publication Date: 2017-01-10
  • Inventor: Ole WaldmannEric A. PapeKeith William GaffHarmeet Singh
  • Applicant: Lam Research Corporation
  • Applicant Address: US CA Fremont
  • Assignee: LAM RESEARCH CORPORATION
  • Current Assignee: LAM RESEARCH CORPORATION
  • Current Assignee Address: US CA Fremont
  • Main IPC: H01L21/00
  • IPC: H01L21/00 H01L21/67
Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control element
Abstract:
A method for auto-correction of at least one malfunctioning thermal control element among an array of thermal control elements that are independently controllable and located in a temperature control plate of a substrate support assembly which supports a semiconductor substrate during processing thereof, the method including: detecting, by a control unit including a processor, that at least one thermal control element of the array of thermal control elements is malfunctioning; deactivating, by the control unit, the at least one malfunctioning thermal control element; and modifying, by the control unit, a power level of at least one functioning thermal control element in the temperature control plate to minimize impact of the malfunctioning thermal control element on the desired temperature output at the location of the at least one malfunctioning thermal control element.
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