Invention Grant
US09548202B2 Method for bonding by means of molecular adhesion 有权
通过分子粘合键合的方法

  • Patent Title: Method for bonding by means of molecular adhesion
  • Patent Title (中): 通过分子粘合键合的方法
  • Application No.: US14434624
    Application Date: 2013-10-11
  • Publication No.: US09548202B2
    Publication Date: 2017-01-17
  • Inventor: Marcel BroekaartArnaud Castex
  • Applicant: Soitec
  • Applicant Address: FR Bernin
  • Assignee: Soitec
  • Current Assignee: Soitec
  • Current Assignee Address: FR Bernin
  • Agency: TraskBritt
  • Priority: FR1259954 20121018
  • International Application: PCT/IB2013/002280 WO 20131011
  • International Announcement: WO2014/060817 WO 20140424
  • Main IPC: B32B37/00
  • IPC: B32B37/00 H01L21/18 B32B37/10
Method for bonding by means of molecular adhesion
Abstract:
The disclosure relates to a method of bonding by molecular adhesion comprising the positioning of a first wafer and of a second wafer within a hermetically sealed vessel, the evacuation of the vessel to a first pressure lower than or equal to 400 hPa, the adjustment of the pressure in the vessel to a second pressure higher than the first pressure by introduction of a dry gas, and bringing the first and second wafers into contact, followed by the initiation of the propagation of a bonding wave between the two wafers, while maintaining the vessel at the second pressure.
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