Invention Grant
- Patent Title: Method for bonding by means of molecular adhesion
- Patent Title (中): 通过分子粘合键合的方法
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Application No.: US14434624Application Date: 2013-10-11
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Publication No.: US09548202B2Publication Date: 2017-01-17
- Inventor: Marcel Broekaart , Arnaud Castex
- Applicant: Soitec
- Applicant Address: FR Bernin
- Assignee: Soitec
- Current Assignee: Soitec
- Current Assignee Address: FR Bernin
- Agency: TraskBritt
- Priority: FR1259954 20121018
- International Application: PCT/IB2013/002280 WO 20131011
- International Announcement: WO2014/060817 WO 20140424
- Main IPC: B32B37/00
- IPC: B32B37/00 ; H01L21/18 ; B32B37/10

Abstract:
The disclosure relates to a method of bonding by molecular adhesion comprising the positioning of a first wafer and of a second wafer within a hermetically sealed vessel, the evacuation of the vessel to a first pressure lower than or equal to 400 hPa, the adjustment of the pressure in the vessel to a second pressure higher than the first pressure by introduction of a dry gas, and bringing the first and second wafers into contact, followed by the initiation of the propagation of a bonding wave between the two wafers, while maintaining the vessel at the second pressure.
Public/Granted literature
- US20150235851A1 METHOD FOR BONDING BY MEANS OF MOLECULAR ADHESION Public/Granted day:2015-08-20
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