Invention Grant
- Patent Title: MEMS-released curved image sensor
- Patent Title (中): MEMS发布的曲面图像传感器
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Application No.: US14314613Application Date: 2014-06-25
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Publication No.: US09551856B2Publication Date: 2017-01-24
- Inventor: Kaigham Jacob Gabriel , Philip Sean Stetson
- Applicant: Google Inc.
- Applicant Address: US CA Mountain View
- Assignee: Google Inc.
- Current Assignee: Google Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Wolfe-SBMC
- Main IPC: G02B9/02
- IPC: G02B9/02 ; H04N5/232 ; H04N5/247 ; H04N5/225 ; H04N5/374 ; H04N5/335 ; H04N5/369

Abstract:
This document describes MEMS-released curved image sensors capable of sensing light from a monocentric lens. This MEMS-released curved image sensor receives light focused on a curved focal surface by releasing a photodetector side of a computing and sensing wafer, such as a Complementary Metal-Oxide Semiconductor (CMOS) sensor. This releasing is effective to allow the photodetector side to conform to the curved focal surface of the monocentric lens. By so doing, the wider field of view, smaller size, and often smaller weight of monocentric lenses can be gained while using generally high-quality, low-cost computing and sensing wafers by processing these wafers to give them a curved surface at which to sense light from a monocentric lens.
Public/Granted literature
- US20150334300A1 MEMS-Released Curved Image Sensor Public/Granted day:2015-11-19
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