Invention Grant
- Patent Title: Tape sticking apparatus
- Patent Title (中): 胶带装置
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Application No.: US14115616Application Date: 2012-06-28
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Publication No.: US09555607B2Publication Date: 2017-01-31
- Inventor: Yoichiro Taga , Kazumasa Nishiwaki
- Applicant: Yoichiro Taga , Kazumasa Nishiwaki
- Applicant Address: JP Tokyo
- Assignee: NEC ENGINEERING, LTD.
- Current Assignee: NEC ENGINEERING, LTD.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC.
- Priority: JP2011-147018 20110701
- International Application: PCT/JP2012/004186 WO 20120628
- International Announcement: WO2013/005398 WO 20130110
- Main IPC: B32B37/10
- IPC: B32B37/10 ; H01L21/67 ; H01L21/683

Abstract:
A tape sticking apparatus includes a rubber sheet that partitions an airtight space formed above a chamber into first and second airtight spaces and, a tape frame that holds a tape above the rubber sheet, and a supply/exhaust mechanism that switches between pressurizing and depressurizing by supplying gas to or sucking gas from the first and second airtight spaces. The gas supply/exhaust mechanism includes a first flow-rate control valve that controls the flow rate of sucked gas when the first airtight space is depressurized, and a second flow-rate control valve that controls the flow rate of supplied when the first airtight space is pressurized.
Public/Granted literature
- US20140083617A1 TAPE STICKING APPARATUS Public/Granted day:2014-03-27
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