Invention Grant
- Patent Title: Apparatuses and methods for die seal crack detection
- Patent Title (中): 模具密封裂纹检测的装置和方法
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Application No.: US15069316Application Date: 2016-03-14
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Publication No.: US09557376B2Publication Date: 2017-01-31
- Inventor: Charles H. Dennison , Kenneth W. Marr , Deepak Thimmegowda , Philip J. Ireland
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L21/66 ; H01L23/48 ; H01L23/485 ; H01L29/78

Abstract:
Apparatuses and methods can include a die seal between an integrated circuit region of a die and a periphery of the die. A via chain(s) may be arranged around an inner circumference of the die seal between the die seal and the integrated circuit region and/or around an outer circumference of the die seal between the die seal and the periphery of the die. The via chain may include a plurality of contacts comprised of conductive material and extending through portions of the die. Circuitry may be coupled to an end of the via chain to detect an electrical signal. Additional apparatuses and methods are described.
Public/Granted literature
- US20160195581A1 APPARATUSES AND METHODS FOR DIE SEAL CRACK DETECTION Public/Granted day:2016-07-07
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