Invention Grant
US09557643B2 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device using the same and electronic device
有权
图案形成方法，光化射线敏感或辐射敏感性树脂组合物，抗蚀剂膜，使用其的电子器件的制造方法和电子器件
- Patent Title: Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device using the same and electronic device
- Patent Title (中): 图案形成方法，光化射线敏感或辐射敏感性树脂组合物，抗蚀剂膜，使用其的电子器件的制造方法和电子器件
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Application No.: US14451901Application Date: 2014-08-05
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Publication No.: US09557643B2Publication Date: 2017-01-31
- Inventor: Hiroo Takizawa , Tomotaka Tsuchimura , Takeshi Kawabata , Takuya Tsuruta
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-023386 20120206
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/004 ; G03F7/039 ; G03F7/32 ; G03F7/20
Abstract:
There is provided a pattern forming method comprising (1) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin containing an acid-decomposable repeating unit and being capable of decreasing the solubility for an organic solvent-containing developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a compound capable of decomposing by the action of an acid to generate an acid, and (D) a solvent; (2) a step of exposing the film by using an actinic ray or radiation, and (4) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern.
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