Various embodiments comprise apparatuses to assign unique device identifier values to addressable devices in a stacked package. In one embodiment, an apparatus is disclosed including a stacked package with at least two addressable devices. Each of the addressable devices includes data input and switch path circuitry, a shift register coupled to the data input and switch path circuitry, and a single through-substrate via (TSV) through which the unique device identifier values can be assigned. The single TSV is coupled to the data input and switch path circuitry and between adjacent ones of the at least two addressable devices. Additional apparatuses, systems, and methods are described.