Invention Grant
US09559061B2 Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof 有权
基板与载体之间的粘合,在其邻接表面之间没有机械粘合

Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof
Abstract:
Wafer to carrier adhesion without mechanical adhesion for formation of an IC. In such formation, an apparatus has a bottom surface of a substrate abutting a top surface of a support platform without adhesive therebetween. A material is disposed around the substrate and on the top surface of the support platform. The material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface.
Information query
Patent Agency Ranking
0/0