Invention Grant
US09559061B2 Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof
有权
基板与载体之间的粘合,在其邻接表面之间没有机械粘合
- Patent Title: Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof
- Patent Title (中): 基板与载体之间的粘合,在其邻接表面之间没有机械粘合
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Application No.: US15143077Application Date: 2016-04-29
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Publication No.: US09559061B2Publication Date: 2017-01-31
- Inventor: Belgacem Haba , Ilyas Mohammed
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L23/538 ; H01L21/683 ; H01L23/522 ; H01L23/31 ; H01L25/065

Abstract:
Wafer to carrier adhesion without mechanical adhesion for formation of an IC. In such formation, an apparatus has a bottom surface of a substrate abutting a top surface of a support platform without adhesive therebetween. A material is disposed around the substrate and on the top surface of the support platform. The material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface.
Public/Granted literature
- US20160247764A1 Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof Public/Granted day:2016-08-25
Information query
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