发明授权
- 专利标题: Semiconductor device and method for manufacturing semiconductor device
- 专利标题(中): 半导体装置及半导体装置的制造方法
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申请号: US14576400申请日: 2014-12-19
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公开(公告)号: US09559193B2公开(公告)日: 2017-01-31
- 发明人: Atsuo Isobe , Toshinari Sasaki , Shinya Sasagawa , Akihiro Ishizuka
- 申请人: Semiconductor Energy Laboratory Co., Ltd.
- 申请人地址: JP Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Kanagawa-ken
- 代理机构: Robinson Intellectual Property Law Office
- 代理商 Eric J. Robinson
- 优先权: JP2011-095606 20110422
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L29/66 ; H01L27/115 ; H01L27/12 ; H01L29/786 ; H01L21/02 ; H01L21/477 ; H01L29/04 ; H01L29/24
摘要:
A semiconductor device having a transistor including an oxide semiconductor film is disclosed. In the semiconductor device, the oxide semiconductor film is provided along a trench formed in an insulating layer. The trench includes a lower end corner portion and an upper end corner portion having a curved shape with a curvature radius of longer than or equal to 20 nm and shorter than or equal to 60 nm, and the oxide semiconductor film is provided in contact with a bottom surface, the lower end corner portion, the upper end corner portion, and an inner wall surface of the trench. The oxide semiconductor film includes a crystal having a c-axis substantially perpendicular to a surface at least over the upper end corner portion.
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