Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
- Patent Title (中): 半导体装置及半导体装置的制造方法
-
Application No.: US14576400Application Date: 2014-12-19
-
Publication No.: US09559193B2Publication Date: 2017-01-31
- Inventor: Atsuo Isobe , Toshinari Sasaki , Shinya Sasagawa , Akihiro Ishizuka
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2011-095606 20110422
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L27/115 ; H01L27/12 ; H01L29/786 ; H01L21/02 ; H01L21/477 ; H01L29/04 ; H01L29/24

Abstract:
A semiconductor device having a transistor including an oxide semiconductor film is disclosed. In the semiconductor device, the oxide semiconductor film is provided along a trench formed in an insulating layer. The trench includes a lower end corner portion and an upper end corner portion having a curved shape with a curvature radius of longer than or equal to 20 nm and shorter than or equal to 60 nm, and the oxide semiconductor film is provided in contact with a bottom surface, the lower end corner portion, the upper end corner portion, and an inner wall surface of the trench. The oxide semiconductor film includes a crystal having a c-axis substantially perpendicular to a surface at least over the upper end corner portion.
Public/Granted literature
- US20150171195A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2015-06-18
Information query
IPC分类: