Invention Grant
- Patent Title: Cylindrical lapping
- Patent Title (中): 圆柱研磨
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Application No.: US14185074Application Date: 2014-02-20
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Publication No.: US09561576B2Publication Date: 2017-02-07
- Inventor: Simon Regis Louis Lancaster-Larocque , Collin D. Chan
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: B24B37/02
- IPC: B24B37/02 ; B24B37/005 ; B24B5/04

Abstract:
The described embodiments relate generally to lapping operations and related systems and apparatuses. Various embodiments of lapping tables are described for applying a lapping operation to a non-planar surface of a workpiece. For example, methods and apparatus are described which allow a lapping operation to be applied to a curved outer surface portion of a cylindrical workpiece. Lapping of non-planar outer surfaces of workpieces is conducted by rotating the workpieces during the lapping operations.
Public/Granted literature
- US20140364038A1 CYLINDRICAL LAPPING Public/Granted day:2014-12-11
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