Invention Grant
US09561576B2 Cylindrical lapping 有权
圆柱研磨

Cylindrical lapping
Abstract:
The described embodiments relate generally to lapping operations and related systems and apparatuses. Various embodiments of lapping tables are described for applying a lapping operation to a non-planar surface of a workpiece. For example, methods and apparatus are described which allow a lapping operation to be applied to a curved outer surface portion of a cylindrical workpiece. Lapping of non-planar outer surfaces of workpieces is conducted by rotating the workpieces during the lapping operations.
Public/Granted literature
Information query
Patent Agency Ranking
0/0