Invention Grant
- Patent Title: Mask assembly and photolithography process using the same
- Patent Title (中): 面罩组装和光刻工艺使用相同
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Application No.: US14793728Application Date: 2015-07-07
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Publication No.: US09563117B2Publication Date: 2017-02-07
- Inventor: Yung-Wen Hung
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: Jianq Chyun IP Office
- Priority: CN201510170604 20150413
- Main IPC: G03F1/38
- IPC: G03F1/38 ; G03F7/20

Abstract:
A mask assembly including a first mask and a second mask is provided. The first mask includes a plurality of first main features parallel to each other, a plurality of first sub-resolution assistant features (SRAFs) and a plurality of second SRAFs. The second SRAFs are separately disposed at one side of the first main features. The first SRAFs are separately disposed between the first main features and the second SRAFs. An extension direction of the first main features is parallel to an extension direction of the second SRAFs. The second mask includes a plurality of second main features parallel to each other. When the first mask and the second mask are placed at a predetermined position above a negative-type development photoresist layer for performing exposure respectively, the second main features intersect with the first main features and the second main features overlap with the first SRAFs.
Public/Granted literature
- US20160299418A1 MASK ASSEMBLY AND PHOTOLITHOGRAPHY PROCESS USING THE SAME Public/Granted day:2016-10-13
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