Invention Grant
- Patent Title: Solid-state imaging apparatus, manufacturing method therefor, and electronic apparatus
- Patent Title (中): 固体摄像装置及其制造方法以及电子设备
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Application No.: US14912659Application Date: 2014-08-15
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Publication No.: US09564465B2Publication Date: 2017-02-07
- Inventor: Hiroshi Tayanaka
- Applicant: SONY CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JP2013-176619 20130828
- International Application: PCT/JP2014/071464 WO 20140815
- International Announcement: WO2015/029798 WO 20150305
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
The present technology relates to a solid-state imaging apparatus, a manufacturing method therefor, and an electronic apparatus by which fine pixel signals can be suitably generated.A charge accumulation section that is formed on a first semiconductor substrate and accumulates photoelectrically converted charges, a charge-retaining section that is formed on a second semiconductor substrate and retains charges accumulated in the charge accumulation section, and a transfer transistor that is formed on the first semiconductor substrate and the second semiconductor substrate and transfers charges accumulated in the charge accumulation section to the charge-retaining section are provided. A bonding interface between the first semiconductor substrate and the second semiconductor substrate is formed in a channel of the transfer transistor.
Public/Granted literature
- US20160204153A1 SOLID-STATE IMAGING APPARATUS, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS Public/Granted day:2016-07-14
Information query
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