Invention Grant
- Patent Title: Method of forming magnetic tunneling junctions
- Patent Title (中): 形成磁隧道结的方法
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Application No.: US14201439Application Date: 2014-03-07
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Publication No.: US09564582B2Publication Date: 2017-02-07
- Inventor: Mahendra Pakala , Mihaela Balseanu , Jonathan Germain , Jaesoo Ahn , Lin Xue
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L27/22
- IPC: H01L27/22 ; H01L43/12 ; H01L43/08

Abstract:
A method for fabricating an MRAM bit that includes depositing a spacer layer that protects the tunneling barrier layer during processing is disclosed. The deposited spacer layer prevents byproducts formed in later processing from redepositing on the tunneling barrier layer. Such redeposition may lead to product failure and decreased manufacturing yield. The method further includes non-corrosive processing conditions that prevent damage to the layers of MRAM bits. The non-corrosive processing conditions may include etching without using a halogen-based plasma. Embodiments disclosed herein use an etch-deposition-etch sequence that simplifies processing.
Public/Granted literature
- US20150255507A1 METHOD OF FORMING MAGNETIC TUNNELING JUNCTIONS Public/Granted day:2015-09-10
Information query
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