发明授权
- 专利标题: Honeycomb structure
- 专利标题(中): 蜂窝结构
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申请号: US14633612申请日: 2015-02-27
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公开(公告)号: US09567885B2公开(公告)日: 2017-02-14
- 发明人: Mitsuhiro Ito
- 申请人: NGK Insulators, Ltd.
- 申请人地址: JP Nagoya
- 专利权人: NGK Insulators, Ltd.
- 当前专利权人: NGK Insulators, Ltd.
- 当前专利权人地址: JP Nagoya
- 代理机构: Burr & Brown, PLLC
- 优先权: JP2014-041375 20140304
- 主分类号: B01D46/24
- IPC分类号: B01D46/24 ; F01N3/022 ; C04B28/24 ; C04B35/565 ; C04B37/00 ; C04B38/00 ; C04B41/85 ; C04B41/00 ; C04B41/50 ; C04B111/00 ; C04B111/32 ; C04B111/34
摘要:
There is provided a honeycomb structure where a crack at a honeycomb substrate is reduced. A honeycomb structure has a honeycomb substrate that has a porous partition wall defining a plurality of cells extending from an inflow end face as one end face to an outflow end face as another end face and becoming channels for a fluid, and an outer circumference coating layer disposed at an outer circumference of the honeycomb substrate. At 25 to 800° C., a thermal expansion coefficient of the outer circumference coating layer is larger than a thermal expansion coefficient of the honeycomb substrate. The thermal expansion coefficients of the outer circumference coating layer and the thermal expansion coefficient at 25 to 800° C. preferably meet a relationship represented by the expression: 1.1
公开/授权文献
- US20150252702A1 HONEYCOMB STRUCTURE 公开/授权日:2015-09-10
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