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US09570588B2 Methods of forming transistor structures including forming channel material after formation processes to prevent damage to the channel material 有权
形成晶体管结构的方法,包括在形成工艺之后形成沟道材料以防止损坏沟道材料

Methods of forming transistor structures including forming channel material after formation processes to prevent damage to the channel material
Abstract:
Methods for fabricating transistor structures are provided, the methods including: forming a fin structure with an upper fin portion and a lower fin portion, the upper fin portion including a sacrificial material; forming a gate structure over the fin; selectively removing the upper fin portion to form a tunnel between the gate structure and lower fin portion; and providing a channel material in the tunnel to define the channel region of the gate structure. The sacrificial material may be a material that can be selectively etched without etching the material of the lower fin portion. The channel material may further be provided to form source and drain regions of the transistor structure, which may result in a junctionless FinFET structure.
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