Invention Grant
US09570588B2 Methods of forming transistor structures including forming channel material after formation processes to prevent damage to the channel material
有权
形成晶体管结构的方法,包括在形成工艺之后形成沟道材料以防止损坏沟道材料
- Patent Title: Methods of forming transistor structures including forming channel material after formation processes to prevent damage to the channel material
- Patent Title (中): 形成晶体管结构的方法,包括在形成工艺之后形成沟道材料以防止损坏沟道材料
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Application No.: US14883045Application Date: 2015-10-14
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Publication No.: US09570588B2Publication Date: 2017-02-14
- Inventor: Murat Kerem Akarvardar , Steven Bentley
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley and Mesiti PC
- Agent Nicholas Mesiti
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/306 ; H01L21/3213

Abstract:
Methods for fabricating transistor structures are provided, the methods including: forming a fin structure with an upper fin portion and a lower fin portion, the upper fin portion including a sacrificial material; forming a gate structure over the fin; selectively removing the upper fin portion to form a tunnel between the gate structure and lower fin portion; and providing a channel material in the tunnel to define the channel region of the gate structure. The sacrificial material may be a material that can be selectively etched without etching the material of the lower fin portion. The channel material may further be provided to form source and drain regions of the transistor structure, which may result in a junctionless FinFET structure.
Public/Granted literature
- US20160190289A1 METHODS OF FORMING TRANSISTOR STRUCTURES Public/Granted day:2016-06-30
Information query
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