Invention Grant
- Patent Title: Method of doping 2-dimensional semiconductor and switching device
- Patent Title (中): 掺杂二维半导体和开关器件的方法
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Application No.: US14340108Application Date: 2014-07-24
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Publication No.: US09570684B2Publication Date: 2017-02-14
- Inventor: Jin-hong Park , Hyung-youl Park , Jae-woo Shim , Jae-ho Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.,Research & Business Foundation Sungkyunkwan University
- Current Assignee: Samsung Electronics Co., Ltd.,Research & Business Foundation Sungkyunkwan University
- Current Assignee Address: KR Gyeonggi-do KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2014-0010889 20140128
- Main IPC: H01L51/00
- IPC: H01L51/00 ; H01L21/225 ; H01L21/762 ; H01L51/05 ; H01L29/16 ; H01L29/24

Abstract:
Example embodiments relate to methods of doping a 2-dimensional semiconductor. The method includes forming a semiconductor layer on a substrate, implanting ions into the semiconductor layer, forming a doped layer formed of a 2-dimensional semiconductor layer or an organic semiconductor layer on the semiconductor layer, and doping the doped layer by diffusing the ions of the semiconductor layer into the doped layer through annealing the substrate.
Public/Granted literature
- US20150214482A1 METHOD OF DOPING 2-DIMENSIONAL SEMICONDUCTOR AND SWITCHING DEVICE Public/Granted day:2015-07-30
Information query
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