Invention Grant
- Patent Title: High frequency circuit module
- Patent Title (中): 高频电路模块
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Application No.: US14485857Application Date: 2014-09-15
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Publication No.: US09571145B2Publication Date: 2017-02-14
- Inventor: Shoji Nagumo , Tetsuro Harada , Minoru Iwanaga , Tomohiro Nagai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-221913 20131025
- Main IPC: H04B1/46
- IPC: H04B1/46 ; H04B1/04 ; H04B1/18
Abstract:
A high frequency circuit module includes a variable inductance circuit portion and a reactance circuit portion. The variable inductance circuit portion is connected between an antenna port and ground. The variable reactance circuit is connected between the antenna port and a front-end port. The variable inductance circuit portion includes a first inductor, a second inductor, and a switch. The first inductor is connected between the antenna port and the ground. The second inductor and the switch are connected in series, and this series circuit is connected in parallel to the first inductor.
Public/Granted literature
- US20150118984A1 HIGH FREQUENCY CIRCUIT MODULE Public/Granted day:2015-04-30
Information query
