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公开(公告)号：US12144104B2
公开(公告)日：2024-11-12
申请号：US17817383
申请日：2022-08-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tetsuro Harada
Abstract: A high frequency module includes a mounting substrate, an inductor, and a plurality of electronic components. The inductor is arranged on the mounting substrate. The inductor is arranged in an inside of the mounting substrate and has a winding portion formed by winding a conductor portion a plurality of times in a thickness direction of the mounting substrate. A first ground layer is formed in a region that is on an inner side of an outer edge of the winding portion in plan view of the mounting substrate, and the first ground layer is arranged closest to the winding portion in the thickness direction of the mounting substrate among ground layers formed in the region in a plurality of ground layers. The first ground layer is overlapped with an inner region but is not overlapped with at least part of the winding portion in plan view of the mounting substrate.
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公开(公告)号：US09571145B2
公开(公告)日：2017-02-14
申请号：US14485857
申请日：2014-09-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shoji Nagumo , Tetsuro Harada , Minoru Iwanaga , Tomohiro Nagai
CPC classification number: H04B1/18 , H04B1/0458
Abstract: A high frequency circuit module includes a variable inductance circuit portion and a reactance circuit portion. The variable inductance circuit portion is connected between an antenna port and ground. The variable reactance circuit is connected between the antenna port and a front-end port. The variable inductance circuit portion includes a first inductor, a second inductor, and a switch. The first inductor is connected between the antenna port and the ground. The second inductor and the switch are connected in series, and this series circuit is connected in parallel to the first inductor.
Abstract translation: 高频电路模块包括可变电感电路部分和电抗电路部分。 可变电感电路部分连接在天线端口和地之间。 可变电抗电路连接在天线端口和前端口之间。 可变电感电路部分包括第一电感器，第二电感器和开关。 第一个电感连接在天线端口和地之间。 第二电感和开关串联连接，该串联电路与第一电感并联。
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公开(公告)号：US11309925B2
公开(公告)日：2022-04-19
申请号：US17224154
申请日：2021-04-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Sho Matsumoto , Takanori Uejima , Yuji Takematsu , Tetsuro Harada , Dai Nakagawa , Naoya Matsumoto , Yutaka Sasaki , Yuuki Fukuda
Abstract: A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.
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公开(公告)号：US10971466B2
公开(公告)日：2021-04-06
申请号：US16533982
申请日：2019-08-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Katsunari Nakazawa , Takanori Uejima , Motoji Tsuda , Yuji Takematsu , Dai Nakagawa , Tetsuro Harada , Masahide Takebe , Naoya Matsumoto , Yoshiaki Sukemori , Mitsunori Samata , Yutaka Sasaki , Yuuki Fukuda
IPC: H03F3/21 , H03F1/30 , H01L23/00 , H01L25/16 , H01L23/66 , H01L23/367 , H01L23/538 , H04B1/40
Abstract: A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.
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公开(公告)号：US10964657B2
公开(公告)日：2021-03-30
申请号：US16512790
申请日：2019-07-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Katsunari Nakazawa , Takanori Uejima , Motoji Tsuda , Yuji Takematsu , Dai Nakagawa , Tetsuro Harada , Masahide Takebe , Naoya Matsumoto , Yoshiaki Sukemori , Mitsunori Samata , Yutaka Sasaki , Yuki Fukuda
Abstract: A radio-frequency module includes: a transmission power amplifier that includes first and second amplification transistors that are cascade connected to each other; and a mounting substrate that has first and second main surface that face each other, the transmission power amplifier being mounted on the first main surface. The first amplification transistor is arranged in a final stage and has a first emitter terminal. The second amplification transistor is arranged in a stage preceding the first amplification transistor and has a second emitter terminal. The mounting substrate has first to fourth ground electrode layers in order of proximity to the first main surface. The first emitter terminal and the second emitter terminal are not electrically connected to each other via an electrode on the first main surface and are not electrically connected to each other via the first ground electrode layer.
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Patent Agency Ranking
公开(公告)号：US10715186B2
公开(公告)日：2020-07-14
申请号：US16364527
申请日：2019-03-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tetsuro Harada
Abstract: In a high frequency module, a first band processing circuit, a second band processing circuit, and a third band processing circuit. The first band processing circuit is used at the same time as the third band processing circuit (D3) when wireless communication is performed. A frequency of a harmonic of a first transmission signal of the first band processing circuit is included in a frequency band of a third reception signal of the third band processing circuit. The second band processing circuit is not used at the same time as the first band processing circuit and the third band processing circuit (D3) when wireless communication is performed and is disposed between the first band processing circuit and the third band processing circuit in a plan view of the substrate.
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公开(公告)号：US12096552B2
公开(公告)日：2024-09-17
申请号：US17216722
申请日：2021-03-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuji Takematsu , Takanori Uejima , Sho Matsumoto , Tetsuro Harada , Dai Nakagawa , Naoya Matsumoto , Yutaka Sasaki , Yuuki Fukuda
CPC classification number: H05K1/0243 , H03F3/195 , H03F3/245 , H04B1/44 , H03F2200/294 , H03F2200/318 , H03F2200/451 , H05K2201/1006 , H05K2201/10098
Abstract: A radio frequency module includes: a first mounting board having a first principal surface and a second principal surface; a second mounting board having a third principal surface facing the second principal surface and a fourth principal surface; a transmission filter having a first mounting surface facing the second principal surface and a first top surface; and a reception filter having a second mounting surface facing the third principal surface and a second top surface; wherein the transmission and reception filters overlap at least partially in a plan view of the first and second mounting boards, an output terminal of the transmission filter is arranged on the first top surface, an input terminal of the reception filter is arranged on the second top surface, and the output and input terminals are connected by a conductive member not routed through the first mounting board or the second mounting board.
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公开(公告)号：US10348268B2
公开(公告)日：2019-07-09
申请号：US15849930
申请日：2017-12-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tetsuro Harada
Abstract: A demultiplexing circuit (10) includes a band switch (20) and a first communication band phase adjustment circuit (30). The band switch (20) includes a shared terminal (P20) connected to a shared connection end (110), a first selection target terminal (P21) connected to a second signal end (122), and a second selection target terminal (P22) connected to a third signal end (123). In the band switch (20), the first selection target terminal (P21) and the second selection target terminal (P22) are selectively connected to the shared terminal (P20) in response to the communication band to be transmitted. The first communication band phase adjustment circuit (30) is connected between a first signal end (121) and a predetermined position in a transmission path where the shared connection end (110) and the shared terminal (P20) are connected.
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公开(公告)号：US09883585B2
公开(公告)日：2018-01-30
申请号：US14731527
申请日：2015-06-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tetsuro Harada
CPC classification number: H05K1/0298 , H03H7/0115 , H03H7/38 , H03H2001/0085 , H05K1/115 , H05K1/165 , H05K1/181 , H05K2201/0195 , H05K2201/10053 , H05K2201/10098
Abstract: A radio-frequency circuit module includes a multilayer body and a surface-mount component mounted on a front surface of the multilayer body. The surface-mount component includes variable capacitance elements integrated therein. Inductors including conductor patterns are provided in the multilayer body. On a back surface of the multilayer body, a first external connection terminal and a second external connection terminal are sandwiched between ground connection terminals. Ground via-conductors connected to ground connection terminals extend to the front surface of the multilayer body. The ground via-conductors are connected to each other in a layer near the front surface by a ground connection conductor which extends in a direction perpendicular or substantially perpendicular to the extending direction.
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公开(公告)号：US11476226B2
公开(公告)日：2022-10-18
申请号：US16727141
申请日：2019-12-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori Uejima , Yuji Takematsu , Naoya Matsumoto , Shou Matsumoto , Tetsuro Harada , Dai Nakagawa , Yutaka Sasaki , Yuuki Fukuda
IPC: H03F1/56 , H04B1/40 , H01L23/00 , H01L23/66 , H03F3/24 , H03F3/68 , H01L23/31 , H01L23/552 , H01L25/18 , H01L23/538
Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
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