Invention Grant
- Patent Title: Printed circuit board and method for manufacturing the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US13997464Application Date: 2011-12-23
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Publication No.: US09572250B2Publication Date: 2017-02-14
- Inventor: Sang Myung Lee , Sung Woon Yoon , Hyuk Soo Lee , Sung Won Lee , Ki Do Chun
- Applicant: Sang Myung Lee , Sung Woon Yoon , Hyuk Soo Lee , Sung Won Lee , Ki Do Chun
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2010-0134488 20101224; KR10-2010-0134489 20101224
- International Application: PCT/KR2011/010024 WO 20111223
- International Announcement: WO2012/087058 WO 20120628
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/02 ; H05K3/06 ; H05K3/38 ; H05K3/42

Abstract:
Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.
Public/Granted literature
- US20140069705A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-03-13
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