Invention Grant
US09575281B2 Lens array fabrication method, and film containing base plate and film attaching instrument employed in same
有权
透镜阵列制造方法,以及其中使用的含有底板和膜安装装置的薄膜
- Patent Title: Lens array fabrication method, and film containing base plate and film attaching instrument employed in same
- Patent Title (中): 透镜阵列制造方法,以及其中使用的含有底板和膜安装装置的薄膜
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Application No.: US14371932Application Date: 2012-12-28
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Publication No.: US09575281B2Publication Date: 2017-02-21
- Inventor: Masahiro Tanazawa , Shimpei Morioka , Makoto Goto , Nobuhiro Hashimoto
- Applicant: ENPLAS CORPORATION , TOMOEGAWA CO., LTD.
- Applicant Address: JP Kawaguchi-shi JP Tokyo
- Assignee: ENPLAS CORPORATION,TOMOEGAWA CO., LTD.
- Current Assignee: ENPLAS CORPORATION,TOMOEGAWA CO., LTD.
- Current Assignee Address: JP Kawaguchi-shi JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP2012-016959 20120130
- International Application: PCT/JP2012/084095 WO 20121228
- International Announcement: WO2013/114784 WO 20130808
- Main IPC: B32B37/00
- IPC: B32B37/00 ; G02B7/00 ; B32B38/10 ; B32B43/00 ; G02B3/00 ; G02B6/38 ; G02B6/42 ; G02B6/32

Abstract:
A lens array fabrication method for fabricating a lens array includes: receiving pins of a film attaching instrument (jig) in second guide holes of a film-containing base plate; bonding a placement area and an adhesion layer (F); removing the pins; causing a detachment between a first detachment film (C) and a pressure-sensitive adhesive optical film (D); separating three layers (D) to (F) from two layers (B) and (C); receiving the pins in first guide holes of a lens array main unit; fitting a film holding protrusion in a depression part; bonding the film (D) to a bonding region (i); removing the pins; and causing a detachment between the film (D) and a second detachment film (E).
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