Invention Grant
US09576865B2 Film for semiconductor package, semiconductor package using film and display device including the same
有权
用于半导体封装的薄膜，使用薄膜的半导体封装以及包括其的显示装置
- Patent Title: Film for semiconductor package, semiconductor package using film and display device including the same
- Patent Title (中): 用于半导体封装的薄膜，使用薄膜的半导体封装以及包括其的显示装置
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Application No.: US14964523Application Date: 2015-12-09
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Publication No.: US09576865B2Publication Date: 2017-02-21
- Inventor: Soyoung Lim , JaeMin Jung , Jeong-Kyu Ha , Donghan Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2015-0000066 20150102
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/66 ; H01L23/00 ; H01L23/498
Abstract:
A semiconductor package may include a first output test pad and a second output test pad disposed on a first surface of an insulating film, and a semiconductor chip disposed between the first output test pad and the second output test pad on a second surface opposing to the first surface of the insulating film.
Public/Granted literature
- US20160197020A1 FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AND DISPLAY DEVICE INCLUDING THE SAME Public/Granted day:2016-07-07
Information query
IPC分类:
