公开(公告)号：US10304764B2

公开(公告)日：2019-05-28

申请号：US15465146

申请日：2017-03-21

申请人： Samsung Electronics Co., Ltd.

发明人： Yechung Chung ,  Woonbae Kim ,  Soyoung Lim ,  Jeong-Kyu Ha

IPC分类号： H01L23/498 ,  H01L23/00

摘要： In an embodiment, the film product includes a film substrate having a first surface and a second surface opposite the first surface. The film substrate has a length in a first direction and a width in a second direction perpendicular to the first direction. A first plurality of pads is on one of the first surface and the second surface, and the first plurality of pads is arranged in a third direction, the third direction being diagonal with respect to at least one of the first direction and the second direction. At least one merge line is electrically connecting at least two of the first plurality of pads.

公开(公告)号：US09922891B2

公开(公告)日：2018-03-20

申请号：US15404110

申请日：2017-01-11

申请人： Samsung Electronics Co., Ltd.

发明人： Soyoung Lim ,  JaeMin Jung ,  Jeong-Kyu Ha ,  Donghan Kim

IPC分类号： H01L23/58 ,  H01L21/66 ,  H01L23/00 ,  H01L23/498 ,  H01L23/66 ,  G09G5/00

CPC分类号： H01L22/32 ,  G09G5/003 ,  G09G2310/0264 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/66 ,  H01L24/09 ,  H01L24/16 ,  H01L2223/6616 ,  H01L2224/0912 ,  H01L2224/1415 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/73204

摘要： A semiconductor package may include a first output test pad and a second output test pad disposed on a first surface of an insulating film, and a semiconductor chip disposed between the first output test pad and the second output test pad on a second surface opposing to the first surface of the insulating film.

公开(公告)号：US09576865B2

公开(公告)日：2017-02-21

申请号：US14964523

申请日：2015-12-09

申请人： Samsung Electronics Co., Ltd.

发明人： Soyoung Lim ,  JaeMin Jung ,  Jeong-Kyu Ha ,  Donghan Kim

IPC分类号： H01L23/58 ,  H01L21/66 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L22/32 ,  G09G5/003 ,  G09G2310/0264 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/66 ,  H01L24/09 ,  H01L24/16 ,  H01L2223/6616 ,  H01L2224/0912 ,  H01L2224/1415 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/73204

摘要： A semiconductor package may include a first output test pad and a second output test pad disposed on a first surface of an insulating film, and a semiconductor chip disposed between the first output test pad and the second output test pad on a second surface opposing to the first surface of the insulating film.

摘要翻译： 半导体封装可以包括设置在绝缘膜的第一表面上的第一输出测试焊盘和第二输出测试焊盘，以及设置在与第一输出测试焊盘和第二输出测试焊盘相对的第二表面上的第二输出测试焊盘之间的半导体芯片 绝缘膜的第一表面。

公开(公告)号：US11862548B2

公开(公告)日：2024-01-02

申请号：US17340280

申请日：2021-06-07

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Kyoungsuk Yang ,  Soyoung Lim ,  Yechung Chung

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/66 ,  H01L23/538 ,  H01L25/18

CPC分类号： H01L23/49838 ,  H01L21/481 ,  H01L21/486 ,  H01L22/14 ,  H01L23/49827 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/4985 ,  H01L23/5387 ,  H01L25/18

摘要： A package substrate film including a film substrate including upper and lower surfaces; a test pattern including an upper test line pattern extending on the upper surface of the film substrate; a lower test line pattern extending on the lower surface of the film substrate; a first test via pattern penetrating the film substrate and connecting the upper test line pattern to the lower test line pattern; a second test via pattern penetrating the film substrate outside the first test via pattern and connecting the upper test line pattern to the lower test line pattern; and a test pad between the first test via pattern and the second test via pattern, the test pad including first test pad at an outer side of the first test via pattern; and second test pad at an inner side of the second test via pattern and facing the first test pad.

公开(公告)号：US09313889B2

公开(公告)日：2016-04-12

申请号：US14262658

申请日：2014-04-25

申请人： Samsung Electronics Co., Ltd.

发明人： Kyoungsuk Yang ,  Jeong-Kyu Ha ,  PaLan Lee ,  Narae Shin ,  Soyoung Lim ,  Jae-Min Jung ,  KyongSoon Cho

IPC分类号： H05B33/00 ,  H05K1/02 ,  H05K5/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC分类号： H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0949 ,  H05K2201/10128

摘要： Provided is a display apparatus. The display apparatus includes a display panel, a flexible circuit film having a rear surface connected to the display panel, and a front surface opposite to the rear surface, the front surface having a chip mounted thereon, and a first lead bonding portion electrically connecting the chip to the display panel. The first lead bonding portion includes a first portion connected to the chip and overlying a portion of the flexible circuit film, a second portion passing through the flexible circuit film, and a third portion disposed between the flexible circuit film and the display panel on the rear surface of the flexible circuit film, where the third portion overlaps the first portion.

摘要翻译： 提供了一种显示装置。 显示装置包括显示面板，具有连接到显示面板的后表面的柔性电路薄膜和与背面相对的前表面，前表面具有安装在其上的芯片，以及第一引线接合部分， 芯片到显示面板。 第一引线接合部分包括连接到芯片并覆盖柔性电路膜的一部分的第一部分，穿过柔性电路膜的第二部分和设置在柔性电路膜和后面的显示面板之间的第三部分 柔性电路膜的表面，其中第三部分与第一部分重叠。