Invention Grant
- Patent Title: Integrated circuits including organic interlayer dielectric layers and methods for fabricating the same
- Patent Title (中): 包括有机层间电介质层的集成电路及其制造方法
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Application No.: US14729188Application Date: 2015-06-03
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Publication No.: US09576894B2Publication Date: 2017-02-21
- Inventor: Sunil Kumar Singh , Ravi Prakash Srivastava , Xusheng Wu , Akshey Sehgal , Teck Jung Tang
- Applicant: GLOBALFOUNDRIES, INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Lorenz & Kopf, LLP
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/768 ; H01L21/02 ; H01L23/532 ; H01L21/311
Abstract:
Integrated circuits and methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes depositing an organic dielectric material overlying a semiconductor substrate for forming an organic interlayer dielectric (OILD) layer. An opening is formed in the OILD layer and a conductive metal fill is deposited in the opening for forming a metal line and/or a via.
Public/Granted literature
- US20160358851A1 INTEGRATED CIRCUITS INCLUDING ORGANIC INTERLAYER DIELECTRIC LAYERS AND METHODS FOR FABRICATING THE SAME Public/Granted day:2016-12-08
Information query
IPC分类:
