发明授权
- 专利标题： Multi-strike process for bonding
- 专利标题（中）： 用于粘合的多重冲击过程
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申请号： US14997727申请日： 2016-01-18
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公开(公告)号： US09576929B1公开(公告)日： 2017-02-21
- 发明人: Tung-Liang Shao , Chih-Hang Tung , Wen-Lin Shih , Hsiao-Yun Chen , Chen-Hua Yu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/44 ; H01L23/00 ; B23K1/00 ; B23K1/06
摘要：
A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.
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