Invention Grant
- Patent Title: Method for fabricating a semiconductor package and semiconductor package
- Patent Title (中): 半导体封装和半导体封装的制造方法
-
Application No.: US14254214Application Date: 2014-04-16
-
Publication No.: US09576935B2Publication Date: 2017-02-21
- Inventor: Michael Bauer , Ludwig Heitzer , Christian Stuempfl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/065 ; H01L25/00 ; H01L21/56 ; H01L23/31 ; H01L23/495
Abstract:
A method for fabricating semiconductor packages includes providing a first substrate having an aperture, providing a first semiconductor chip, connecting the first semiconductor chip to the first substrate, filling the aperture with a first insulating material and encapsulating the semiconductor chip with a second insulating material to create a first encapsulation body.
Public/Granted literature
- US20150303135A1 Method for Fabricating a Semiconductor Package and Semiconductor Package Public/Granted day:2015-10-22
Information query
IPC分类:
