发明授权
- 专利标题： Method for fabricating a semiconductor package and semiconductor package
- 专利标题（中）： 半导体封装和半导体封装的制造方法
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申请号： US14254214申请日： 2014-04-16
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公开(公告)号： US09576935B2公开(公告)日： 2017-02-21
- 发明人: Michael Bauer , Ludwig Heitzer , Christian Stuempfl
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Murphy, Bilak & Homiller, PLLC
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L25/065 ; H01L25/00 ; H01L21/56 ; H01L23/31 ; H01L23/495
摘要：
A method for fabricating semiconductor packages includes providing a first substrate having an aperture, providing a first semiconductor chip, connecting the first semiconductor chip to the first substrate, filling the aperture with a first insulating material and encapsulating the semiconductor chip with a second insulating material to create a first encapsulation body.
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