Invention Grant
- Patent Title: Leadframe package with pre-applied filler material
- Patent Title (中): 引线框封装，预填充材料
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Application No.: US14579902Application Date: 2014-12-22
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Publication No.: US09578744B2Publication Date: 2017-02-21
- Inventor: Jefferson Talledo , Frederick Ray Gomez
- Applicant: STMicroelectronics, Inc.
- Applicant Address: PH Calamba
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: PH Calamba
- Agency: Seed IP Law Group LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/02 ; H01L23/48 ; H01L23/52 ; H05K1/11 ; H01L23/00 ; H05K1/18 ; H01L23/31 ; H01L21/56
Abstract:
Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.
Public/Granted literature
- US20160183369A1 LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL Public/Granted day:2016-06-23
Information query
IPC分类:
