Invention Grant
- Patent Title: Components of an electronic device and methods for their assembly
- Patent Title (中): 电子设备的组件及其组装方法
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Application No.: US13610782Application Date: 2012-09-11
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Publication No.: US09578769B2Publication Date: 2017-02-21
- Inventor: Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
- Applicant: Charles B. Woodhull , David A. Pakula , Tang Y. Tan , Douglas Joseph Weber , Christopher D. Prest , Dale N. Memering , Bryan P. Kiple
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: H01Q1/42
- IPC: H01Q1/42 ; H05K5/04 ; B23P11/00 ; B23P17/00 ; G03F1/38 ; H01Q1/24 ; H04M1/02 ; H05K5/02 ; H05K13/00 ; C25D11/02 ; C25D7/00 ; C25D11/12 ; H05K5/03 ; C25D11/34 ; B23C5/10 ; B23C5/00 ; B23P17/02 ; H04M1/11 ; C25D11/24
Abstract:
Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
Public/Granted literature
- US20130321237A1 COMPONENTS OF AN ELECTRONIC DEVICE AND METHODS FOR THEIR ASSEMBLY Public/Granted day:2013-12-05
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