Invention Grant
- Patent Title: Method and system for manufacturing integrated fluidic chips
- Patent Title (中): 集成流体芯片制造方法和系统
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Application No.: US13813625Application Date: 2009-07-23
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Publication No.: US09579830B2Publication Date: 2017-02-28
- Inventor: David S. Cohen
- Applicant: David S. Cohen
- Applicant Address: US CA South San Francisco
- Assignee: Fluidigm Corporation
- Current Assignee: Fluidigm Corporation
- Current Assignee Address: US CA South San Francisco
- Agency: Kilpatrick Townsend & Stockton LLP
- International Application: PCT/US2009/051568 WO 20090723
- International Announcement: WO2010/011852 WO 20100128
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B32B37/18 ; B32B38/00 ; B29C41/02 ; G01N30/60 ; B29K83/00 ; B29L9/00 ; B29L31/00
Abstract:
An integrated fluidic chip includes a substrate defined by a lateral surface area greater than 28 square inches. The integrated fluidic chip also includes a first elastomeric layer having a mold surface and a top surface. The mold surface of the first elastomeric layer is joined to a portion of the substrate. The first elastomeric layer includes a plurality of first channels extending normally from the substrate to a first dimension inside the first elastomeric layer. The integrated fluidic chip further includes a second elastomeric layer having a mold surface and a top surface. The mold surface of the second elastomeric layer is joined to at least a portion of the top surface of the first elastomeric layer.
Public/Granted literature
- US20150273735A1 METHOD AND SYSTEM FOR MANUFACTURING INTEGRATED FLUIDIC CHIPS Public/Granted day:2015-10-01
Information query
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