Invention Grant
- Patent Title: Controlling adhesives between substrates and carriers
- Patent Title (中): 控制基材和载体之间的粘合剂
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Application No.: US15257625Application Date: 2016-09-06
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Publication No.: US09579893B2Publication Date: 2017-02-28
- Inventor: Rio Rivas , Ed Friesen , Lawrence Thurber , Garrett E. Clark , Rosanna L. Bigford
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc—Patent Department
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/175

Abstract:
Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
Public/Granted literature
- US20160368267A1 CONTROLLING ADHESIVES BETWEEN SUBSTRATES AND CARRIERS Public/Granted day:2016-12-22
Information query
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