A system for transferring a marking material from a ribbon to a substrate is provided. The ribbon has a marking material and a tie layer. The system includes a ribbon take-up device; a ribbon supply source that supplies the ribbon to the ribbon take-up device such that the ribbon is moved in a process direction; a first laser beam source configured to project a laser beam onto the ribbon to define an edge outline to a pattern of a marking portion of the marking material of the ribbon, the marking portion being a portion of the marking material of the ribbon that is to be transferred to the substrate, the first laser beam source being configured to create a weakening of the edge outline; and a heating unit configured to melt the tie layer of the ribbon at the marking portion, the melting taking place at a location where the ribbon is in contact with the substrate, the heating unit being configured to melt the tie layer such that the marking portion transfers to the substrate.