Invention Grant
- Patent Title: Chip component and production method therefor
- Patent Title (中): 芯片组件及其制作方法
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Application No.: US14431771Application Date: 2013-08-07
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Publication No.: US09583238B2Publication Date: 2017-02-28
- Inventor: Yasuhiro Kondo , Katsuya Matsuura
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2012-215062 20120927
- International Application: PCT/JP2013/071412 WO 20130807
- International Announcement: WO2014/050322 WO 20140403
- Main IPC: H01C10/00
- IPC: H01C10/00 ; H01C1/012 ; H01C1/14 ; H01G2/06 ; H01G4/228 ; H01G5/01 ; H01G4/30 ; H01C7/00 ; H01C17/06 ; H01G4/008
Abstract:
A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.
Public/Granted literature
- US20150243412A1 CHIP COMPONENT AND PRODUCTION METHOD THEREFOR Public/Granted day:2015-08-27
Information query
