Invention Grant
US09583371B2 Electrostatic chuck and apparatus for processing a substrate including the same
有权
静电吸盘和用于处理包含该衬底的衬底的设备
- Patent Title: Electrostatic chuck and apparatus for processing a substrate including the same
- Patent Title (中): 静电吸盘和用于处理包含该衬底的衬底的设备
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Application No.: US14108684Application Date: 2013-12-17
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Publication No.: US09583371B2Publication Date: 2017-02-28
- Inventor: Jea-Eun Jess Shim , Jin-Man Kim , Hee-Sam Kim , Jong-Bum Park , Kwang-Bo Sim , Sang-Young Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: .F. Chau & Associates, LLC
- Priority: KR10-2012-0147263 20131217
- Main IPC: C23C16/50
- IPC: C23C16/50 ; C23C16/00 ; C23F1/00 ; H01L21/306 ; H01L21/683 ; H01J37/32

Abstract:
An ESC may include a dielectric layer, an electrode, a pedestal, a heater, an adhesive and a protecting ring. The dielectric layer may be configured to support a substrate. The electrode may be disposed in the dielectric layer and is configured to form plasma over the substrate. The pedestal may be disposed under the dielectric layer. The heater may be disposed between the pedestal and the dielectric layer and is configured to heat the substrate. The adhesive may be disposed between the pedestal and the heater, and between the heater and the dielectric layer. The protecting ring may be configured to surround the adhesive. The protecting ring may include a plasma-resistant material.
Public/Granted literature
- US20150170951A1 ELECTROSTATIC CHUCK AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING THE SAME Public/Granted day:2015-06-18
Information query
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