Invention Grant
US09583433B2 Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer
有权
集成器件封装，其包括在封装层中被配置为电感器的导电片
- Patent Title: Integrated device package comprising conductive sheet configured as an inductor in an encapsulation layer
- Patent Title (中): 集成器件封装，其包括在封装层中被配置为电感器的导电片
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Application No.: US14631391Application Date: 2015-02-25
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Publication No.: US09583433B2Publication Date: 2017-02-28
- Inventor: Young Kyu Song , Hong Bok We , Kyu-Pyung Hwang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/522 ; H01L23/31 ; H01L23/48 ; H01L21/56 ; H01L49/02 ; H01F27/28 ; H01F27/29 ; H01L23/64 ; H01L23/498 ; H01L23/00
Abstract:
An integrated device package includes a package substrate, a die coupled to the package substrate, an encapsulation layer encapsulating the die, and at least one sheet of electrically conductive material configured to operate as an inductor. The sheet of electrically conductive material is at least partially encapsulated by the encapsulation layer. The sheet of electrically conductive material is configured to operate as a solenoid inductor. The sheet of electrically conductive material includes a first sheet portion, a second sheet portion coupled to the first sheet portion, where the first sheet portion and the second sheet portion form a first winding of the inductor, a first terminal portion coupled to the first sheet portion, and a second terminal portion coupled to the second sheet portion. The first sheet portion is formed on a first level of the sheet. The second sheet portion is formed on a second level of the sheet.
Public/Granted literature
Information query
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