Invention Grant
US09583444B2 Method for applying magnetic shielding layer, method for manufacturing a die, die and system
有权
施加磁屏蔽层的方法，制造模具，模具和系统的方法
- Patent Title: Method for applying magnetic shielding layer, method for manufacturing a die, die and system
- Patent Title (中): 施加磁屏蔽层的方法，制造模具，模具和系统的方法
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Application No.: US13970651Application Date: 2013-08-20
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Publication No.: US09583444B2Publication Date: 2017-02-28
- Inventor: Christian Peters , Robert Allinger , Klaus Knobloch , Snezana Jenei
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L43/02 ; H01L43/12
Abstract:
A method for applying a magnetic shielding layer to a substrate is provided, wherein a first magnetic shielding layer is adhered to a first surface of the substrate. A first film layer is adhered to the first magnetic shielding layer and the first magnetic shielding layer is more adherent to the first surface than the film layer to the first magnetic shielding layer.
Public/Granted literature
- US20150054102A1 Method for Applying Magnetic Shielding Layer, Method for Manufacturing a Die, Die and System Public/Granted day:2015-02-26
Information query
IPC分类:
