Invention Grant
- Patent Title: Fan out system in package and method for forming the same
- Patent Title (中): 封装中的扇出系统及其形成方法
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Application No.: US14637109Application Date: 2015-03-03
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Publication No.: US09583472B2Publication Date: 2017-02-28
- Inventor: Chih-Ming Chung , Jun Zhai , Yizhang Yang
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L21/56 ; H01L21/768 ; H01L23/31 ; H01L23/367 ; H01L23/48 ; H01L23/538 ; H01L23/00 ; H01L25/065 ; H01L25/00 ; H01L23/34 ; H01L23/552 ; H01L25/16
Abstract:
Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), stacked die between the first and second RDLs, and conductive pillars extending between the RDLs. A molding compound may encapsulate the stacked die and conductive pillars between the first and second RDLs.
Public/Granted literature
- US20160260695A1 FAN OUT SYSTEM IN PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2016-09-08
Information query
IPC分类:
